Exhibition
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- Date: 2023-04-24
- Views: 209Times
| Feature | Capability |
| Material | Aluminum core (Domestic 1060), Copper core, FR4 covering |
| Thermal conductivity | 1.0W/(m*k),2.0W/(m*k) |
| Min. Track/Spacing | 4mil |
| Min. Hole Size | 0.8mm |
| Base Material | Aluminum, FR4, Flex, Flex-rigid, HDI, Rogers, etc. |
| Board Thickness | 0.4-3.2mm |
| Surface Finishing | Immersion gold, OSP, Hard Gold,Immersion SIlver,Enepig |
| Finsih Cooper | 1-4oz |
| Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
| Silkscreen | White, Black |
| Via Process | Tenting Vias,Plugged Vias,Vias not covered |
| Testing | Fly Probe Testing (Free) and A.O.I. testing |

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