Inventory of PCB industry project approval and construction projects from Januar

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• Date: 2023-04-24
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Bomin Electronics plans to build a production base for IGBT ceramic liners and IC packaging substrates

On January 4, Bomin Electronics announced that the company had reviewed and approved the "Proposal on the Company's External Investment", and the company planned to sign the "Investment Agreement" with the Hefei Economic Development Zone Management Committee, and planned to invest in Bomin Ceramics in the Economic Development Zone. Liner and IC packaging carrier industry base project.
According to the announcement, the total investment of the project is about 5 billion yuan. The site is located in Xinqiao Science and Technology Innovation Demonstration Zone, Hefei, covering an area of about 190 mu (the specific area is subject to actual measurement). It will invest in the construction of a production base for IGBT ceramic liners and IC packaging substrates. , and packaging substrate products for memory chips, MEMS chips, high-speed communication markets and Mini-LED fields. The project adopts the principles of unified planning, sub-item implementation, and carrier board priority. Among them, the total investment of the ceramic lining board project is 2 billion yuan. It is planned to start construction in March 2023 and be completed and put into production in the second quarter of 2024. After the project is fully completed, it is expected to achieve a production capacity of 300,000 ceramic lining boards per month; the total investment of the IC substrate project is 30 It is planned to start construction in January 2024 and complete and put into operation in December 2025.
Pengding Holdings plans to increase capital of Liding Semiconductor by US$136 million

On January 13, Pengding Holdings announced that in order to strengthen the company's investment layout in the semiconductor field, the company intends to sign the "Investment Share Agreement" with its affiliated company Liding Semiconductor Technology (Shenzhen) Co., Ltd. Liding Semiconductor intends to pass this The second capital increase added 21.5905 million US dollars of registered capital, of which 15.1134 million US dollars of registered capital was subscribed by the company in currency. The remaining newly added registered capital will be subscribed by other investors (other investors have not yet been determined).
According to the above agreement, the company will add US$136 million to Leading Semiconductor this time, of which US$15,113,400 will be included in the registered capital of Leading Semiconductor, and the remaining amount will be included in the capital reserve. The existing shareholders of Liding Semiconductor agreed to the company's adjustment of its equity and confirmed the waiver of the preemptive right to subscribe for the new capital involved in this capital increase. Monterey Park Finance Ltd., the controlling shareholder of Leading Semiconductor, holds 100% equity of Meigang Industrial Co., Ltd., the controlling shareholder of the company. Therefore, this transaction constitutes a connected transaction.
Jinlu Electronics plans to expand production by 2.34 billion yuan

On February 8, Jinlu Electronics announced that the company agreed to sign an investment agreement with the Guangdong Qingyuan High-tech Industrial Development Zone Management Committee to obtain the land use rights of about 63 acres of land adjacent to the company's factory area and use the existing part of the company's factory area Block investment of 2.340 billion yuan to build a PCB expansion project; agreeing that the company will use all the excess funds raised from the initial public offering of 231 million yuan and its derivative interest and cash management income for the above-mentioned project investment.
Jinlu Electronics PCB Expansion Project (the filing procedures of the fixed asset investment project of the development and reform department have not yet been fulfilled, and the final project name is subject to the filed name). The main body of the implementation is Jinlu Electronic Technology Co., Ltd. Part of the land use right and use part of the existing land in the company's factory area. On this basis, build 2 factory buildings, 1 wastewater station, 1 dormitory and canteen, and 1 chemical warehouse. Purchase corresponding machinery and equipment and public facilities and carry out information Chemical construction, adding an annual production capacity of 3 million square meters of multi-layer rigid boards and high-density interconnection boards. The project will be constructed in three phases, and it will be put into production at the same time. It will take 60 months from the start of construction to the complete completion.
Sihui Fushi plans to invest in a new production base in Thailand

On February 20, Sihui Fushi announced that the company decided to invest in a new production base in Thailand, with a planned investment of no more than RMB 500 million, including but not limited to the purchase of land, purchase and construction of fixed assets and other related matters. The actual investment amount The amount approved by the Chinese and local authorities shall prevail. The company will implement the construction of a production base in Thailand in stages according to specific conditions such as market demand and business progress.
The company plans to purchase about 130 mu of land in the Amata Industrial Park in Rayong Province, Thailand, to meet the needs of the registration of the production base in Thailand and the construction of future projects. The company plans to implement the construction of the production base in Thailand in stages. The company plans to complete the establishment of the Thai subsidiary in the second half of 2023. The business scope mainly involves the design, manufacture and sales of printed circuit boards. The registration information is finally subject to the approval of the local registration authority, and plans to achieve a certain scale in 2025 Produce.
02Signing

Annual production of 1 million square meters of high-precision printed circuit boards signed in Jiangxi
On January 6, the signing ceremony of Jiangxi Shuanghe Circuit Co., Ltd. was held in Qianshan County Industrial Park, Shangrao City, Jiangxi Province. The company is an enterprise engaged in high-precision PCB processing and sales. The total investment of the project is 250 million yuan, including 150 million yuan in fixed assets, and the construction of a high-precision printed circuit board project with an annual output of 1 million square meters.
Xin Ju Neng COF/COB packaging substrate project signed
On January 8, the signing ceremony for the COF/COB packaging substrate project of Shenzhen Xinjuneng Electronics Co., Ltd. was held in Ganxiang Cooperation Industrial Park, Shangli, Pingxiang, Jiangxi. The total investment of the project is expected to be 650 million yuan, and it will be constructed in two phases, of which the planned investment in the first phase is 182 million yuan, and the planned investment in the second phase is 468 million yuan.
Guangxi Rongxian high-end circuit board industrial park project signed
On January 9, Rongxian County, Guangxi held a centralized signing ceremony for the first batch of major investment promotion projects in 2023 under the theme of "speeding up the first quarter with all efforts and doing everything possible". The project is constructed by Dongguan Zhongteng Industrial Park Operation Management Co., Ltd. with an investment of 2 billion yuan. The project plans to use an area of about 180 mu.
Kingsjet printed circuit board automation factory project signed
On January 27, the 2nd Township Party Development Conference in Shangluo City, Shaanxi Province signed a total of 6 public medical cooperation agreements and 16 investment contract projects. Shanyang High-tech Zone signed a centralized contract with Shenzhen Jinshijie Electronics Co., Ltd. for the printed circuit board automation factory project, with a total investment of 200 million yuan.
Jingwang Electronics signed a new high-layer PCB intelligent manufacturing base project
On February 15, Jingwang Electronics signed a new high-layer PCB intelligent manufacturing base project in Shenzhen, Guangdong Province. On March 6, the project started construction in Xinfeng Shenzhen Industrial Park, Ganzhou City, Jiangxi Province.
Jingwang Electronics' new high-layer PCB intelligent manufacturing base project will be constructed in two phases, with a total investment of about 3 billion yuan, of which fixed asset investment is expected to be more than 2 billion yuan. The project introduces advanced technology, intelligence, and high-precision manufacturing equipment, and will build a high-level PCB R&D and production base with the highest degree of automation, intelligence, production efficiency, and cost advantages.
High-end carrier board industrialization project signed
On February 16, the 2023 Suzhou Wuzhong (Shenzhen) Intelligent Manufacturing Industry Promotion Conference was successfully held in Shenzhen, Guangdong Province. The high-end carrier board industrialization project was signed, and the signing parties were Financial Holding Company, Suzhou Yimai Silicon Semiconductor Technology Co., Ltd. and Investment Promotion Center.
Tungsten alloy new hard material production base project signing
On February 21, the centralized signing ceremony and centralized start-up ceremony for key projects in the first quarter of 2023 in Jin'an District, Lu'an City, Anhui Province was held. Tungsten alloy new hard material production base project signed. The total investment of the project is 200 million yuan. It plans to build and rent a factory building of about 17,000 square meters, purchase electronic product research and development, production, inspection and testing equipment, and produce new hard materials such as PCB consumables and tungsten alloys.
Gao Jianghong double-sided multi-layer circuit board production project signed
On February 24, the first batch of major industrial projects in Miluo City, Hunan Province in 2023 and the signing ceremony for new projects were held in Miluo High-tech Zone. The Gaojianghong double-sided multi-layer circuit board production project invested by Meizhou Gaojianghong Electronic Technology Co., Ltd. was signed intensively.
Baokang Electronics signed a contract for the production of flexible circuit board materials
On February 28, Ganzhou Economic and Technological Development Zone in Jiangxi Province held a centralized signing ceremony for the second batch of investment promotion projects in 2023. Shenzhen Baokang Electronic Materials Co., Ltd. signed a contract for the production project of flexible circuit board materials. The total investment of the project is 600 million yuan.
Weipuyizhan PCB project signed
On February 28, the PCB project of Shenzhen Weipu Yizhan Technology Co., Ltd. was signed and settled in Liaocheng City, Shandong Province. The first phase of the project has been invested in Jiaming Economic Development Zone, Liaocheng, Shandong Province, and the second phase is planned to be invested in Daokoupu Street, Dongchangfu District, with a total investment of 200 million yuan.
Shenzhen Weipu Yizhan Technology Co., Ltd. is a PCB manufacturer integrating R&D, design, and manufacturing. It is committed to the production of high-precision single-sided, double-sided, and multi-layer PCBs. The products are widely used in computers, telecommunications, and LCD liquid crystal modules. , communication equipment, instrumentation, industrial power supply, digital and other fields.
Annual production of 3 million square meters circuit board industrial park project signed
On February 28, the project of the circuit board industrial park with an annual output of 3 million square meters was officially signed in Shexian County, Huangshan City, Anhui Province. The total investment of the project is 1.65 billion yuan, and the planned land area is 100 mu. The construction includes three customized factory buildings, a sewage treatment plant, modern PCB production equipment and a full set of product testing and research and development equipment.